1-2) Cleaning of High Power Packages and Modules after Die Attach and Other Semicon back-end cleaning applications
3) Stencil Cleaning
4) Dispensing needles cleaning
5) Misprint Cleaning
6) DReflow oven, solder pallett, conveyor finger cleaning
7) Electronic Assembly cleaning
4) Reflow Oven Cleaning and Cleaning of Solder Frames and Condensation Traps
5) PCB Cleaning
Semi-aqueous processes
Aqueous (MPC®) processes
Solvent based processes
Based on these areas we are offering different products:
Zestron ®: based on non-halogenated, organic solvents.
Vigon ®: water-based cleaners, using MPC ® technology
Atron ®: new development, water-based tenzid-cleaners
| Substrates |
Contamination |
Solvent based cleaning media |
Water based cleaning media MPC |
Aqueous alkaline based cleaning media |
High power packages, Die attach substrates Wafer bumping BGA |
Tacky fluxes, Lead based solder pastes |
Zestron VD Zestron FA+ Zestron CE |
Vigon A200 Vigon A250 Vigon S100 Vigon US |
Atron AC205 |
| Stencils, screens |
Solder pastes, SMT adhesives |
Zestron SD100 Zestron SD300 Zestron SD301 Zestron SW |
Vigon SC Vigon SC200 Vigon SC202 |
Atron SP200 |
| Dispensing needles |
SMT adhesives |
Zestron HC Zestron ES200 |
|
|
| Misprints |
Solder pastes SMT adhesives |
Zestron SD100 Zestron SD300 Zestron SD301 |
Vigon SC Vigon SC200 Vigon SC202 |
|
Solder frames, Reflow oven, Condensation traps |
Baked-on flux |
|
Vigon RC101 |
Atron SP200 Atron SP300 |
| Electronic assemblies |
Flux residues |
Zestron FA+ Zestron VD |
Vigon A200 Vigon A250 Vigon A300 Vigon US |
Atron AC205 |